RRafael J. Wysockithermal: intel: int340x: Add DLVR support for RFIM control
| 文件 | 最后提交记录 | 最后更新时间 |
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docs: thermal: add it to the driver API The file contents mostly describes driver internals. Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org> Signed-off-by: Jonathan Corbet <corbet@lwn.net> | 6 年前 | |
docs: thermal: convert cpu-idle-cooling.rst to ReST Despite being named with .rst extension, this file doesn't match the ReST standard. It actually causes a crash at Sphinx: Sphinx parallel build error: docutils.utils.SystemMessage: /devel/v4l/docs/Documentation/driver-api/thermal/cpu-idle-cooling.rst:69: (SEVERE/4) Unexpected section title. Add needed markups for it to be properly parsed. Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org> Link: https://lore.kernel.org/r/7640755514809a7b5fe2756f3702613865877dcb.1592203650.git.mchehab+huawei@kernel.org Signed-off-by: Jonathan Corbet <corbet@lwn.net> | 6 年前 | |
thermal: exynos: Rename Samsung and Exynos to lowercase Fix up inconsistent usage of upper and lowercase letters in "Samsung" and "Exynos" names. "SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked names. Therefore they should be written with lowercase letters starting with capital letter. The lowercase "Exynos" name is promoted by its manufacturer Samsung Electronics Co., Ltd., in advertisement materials and on website. Although advertisement materials usually use uppercase "SAMSUNG", the lowercase version is used in all legal aspects (e.g. on Wikipedia and in privacy/legal statements on https://www.samsung.com/semiconductor/privacy-global/). Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org | 6 年前 | |
docs: thermal: add it to the driver API The file contents mostly describes driver internals. Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org> Signed-off-by: Jonathan Corbet <corbet@lwn.net> | 6 年前 | |
Documentation: admin-guide: Move intel_powerclamp documentation Create a folder "thermal" under Documentation/admin-guide and move intel_powerclamp documentation to this folder. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal: intel: int340x: Add DLVR support for RFIM control Add support for DLVR (Digital Linear Voltage Regulator) attributes, which can be used to control RFIM. Here instead of "fivr" another directory "dlvr" is created with DLVR attributes: /sys/bus/pci/devices/0000:00:04.0/dlvr ├── dlvr_freq_mhz ├── dlvr_freq_select ├── dlvr_hardware_rev ├── dlvr_pll_busy ├── dlvr_rfim_enable └── dlvr_spread_spectrum_pct └── dlvr_control_mode └── dlvr_control_lock Attributes dlvr_freq_mhz (RO): Current DLVR PLL frequency in MHz. dlvr_freq_select (RW): Sets DLVR PLL clock frequency. dlvr_hardware_rev (RO): DLVR hardware revision. dlvr_pll_busy (RO): PLL can't accept frequency change when set. dlvr_rfim_enable (RW): 0: Disable RF frequency hopping, 1: Enable RF frequency hopping. dlvr_control_mode (RW): Specifies how frequencies are spread. 0: Down spread, 1: Spread in Center. dlvr_control_lock (RW): 1: future writes are ignored. dlvr_spread_spectrum_pct (RW) A write to this register updates the DLVR spread spectrum percent value. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> [ rjw: Subject edits ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
documentation: Update #nouveau IRC channel network Like many free software projects, Nouveau recently moved from Freenode to OFTC. Update the reference. v3: Add acks. Signed-off-by: Alyssa Rosenzweig <alyssa@rosenzweig.io> Reviewed-by: Karol Herbst <kherbst@redhat.com> Cc: David Airlie <airlied@linux.ie> Cc: Daniel Vetter <daniel@ffwll.ch> Cc: linux-kernel@vger.kernel.org Signed-off-by: Karol Herbst <kherbst@redhat.com> Link: https://patchwork.freedesktop.org/patch/msgid/20210725150007.2818-1-alyssa@rosenzweig.io | 4 年前 | |
PM: EM: Clarify abstract scale usage for power values in Energy Model The Energy Model (EM) can store power values in milli-Watts or in abstract scale. This might cause issues in the subsystems which use the EM for estimating the device power, such as: - mixing of different scales in a subsystem which uses multiple (cooling) devices (e.g. thermal Intelligent Power Allocation (IPA)) - assuming that energy [milli-Joules] can be derived from the EM power values which might not be possible since the power scale doesn't have to be in milli-Watts To avoid misconfiguration add the requisite documentation to the EM and related subsystems: EAS and IPA. Signed-off-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 5 年前 | |
thermal/core: Remove thermal_bind_params structure Remove struct thermal_bind_params because no one is using it for thermal binding now. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230330104526.3196-1-rui.zhang@intel.com | 3 年前 | |
docs: thermal: add it to the driver API The file contents mostly describes driver internals. Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org> Signed-off-by: Jonathan Corbet <corbet@lwn.net> | 6 年前 |