| 文件 | 最后提交记录 | 最后更新时间 |
|---|---|---|
IssueNo::#I8JSR7:[新需求]: 3D增强能力展示:[新需求]: 3D增强能力展示:[新需求]: 3D增强能力展示 Description:检视意见修改 Sig: SIG_Sample Feature or Bugfix:Feature Binary Source:2D_1.jpg,2D_2.jpg,3D_1.jpg,3D_2.jpg, 编译测试结果:Pass 测试用例测试结果:Pass Signed-off-by: tengfeigeng <tengfei.geng@td-tech.com> | 2 年前 | |
IssueNo::#I8JSR7:[新需求]: 3D增强能力展示:[新需求]: 3D增强能力展示:[新需求]: 3D增强能力展示 Description:修改MyXComponent为XComponent3D Sig: SIG_Sample Feature or Bugfix:Feature Binary Source:Screenshots/2D_1.jpg,Screenshots/2D_2.jpg,Screenshots/3D_1.jpg,Screenshots/3D_2.jpg,Screenshots/video.mp4 编译测试结果:Pass 测试用例测试结果:Pass Signed-off-by: tengfeigeng <tengfei.geng@td-tech.com> | 2 年前 | |
修复native应用编译问题 Signed-off-by: yuandongping <yuandongping@huawei.com> | 1 年前 | |
IssueNo::#I8JSR7:[新需求]: 3D增强能力展示:[新需求]: 3D增强能力展示:[新需求]: 3D增强能力展示 Description:修改MyXComponent为XComponent3D Sig: SIG_Sample Feature or Bugfix:Feature Binary Source:Screenshots/2D_1.jpg,Screenshots/2D_2.jpg,Screenshots/3D_1.jpg,Screenshots/3D_2.jpg,Screenshots/video.mp4 编译测试结果:Pass 测试用例测试结果:Pass Signed-off-by: tengfeigeng <tengfei.geng@td-tech.com> | 2 年前 | |
IssueNo::#I8JSR7:[新需求]: 3D增强能力展示:[新需求]: 3D增强能力展示:[新需求]: 3D增强能力展示 Description:修改MyXComponent为XComponent3D Sig: SIG_Sample Feature or Bugfix:Feature Binary Source:Screenshots/2D_1.jpg,Screenshots/2D_2.jpg,Screenshots/3D_1.jpg,Screenshots/3D_2.jpg,Screenshots/video.mp4 编译测试结果:Pass 测试用例测试结果:Pass Signed-off-by: tengfeigeng <tengfei.geng@td-tech.com> | 2 年前 |
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| 2 年前 | ||
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| 2 年前 |