| 文件 | 最后提交记录 | 最后更新时间 |
|---|---|---|
dt-bindings: Remove 'Device Tree Bindings' from end of title: As indicated in link: https://lore.kernel.org/all/20220822204945.GA808626-robh@kernel.org/ DT schema files should not have 'Device Tree Binding' as part of there title: line. Remove this in most .yaml files, so hopefully preventing developers copying it into new .yaml files, and being asked to remove it. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Link: https://lore.kernel.org/r/20220825020427.3460650-1-andrew@lunn.ch Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
dt-bindings: thermal: Get rid of thermal.txt and replace references Now that we have yaml bindings for the thermal subsystem, get rid of the old bindings (thermal.txt). Replace all references to thermal.txt in the Documentation with a link to the appropriate YAML bindings using the following search and replace pattern: - If the reference is specific to the thermal-sensor-cells property, replace with a pointer to thermal-sensor.yaml - If the reference is to the cooling-cells property, replace with a pointer to thermal-cooling-devices.yaml - If the reference is generic thermal bindings, replace with a reference to thermal*.yaml. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/e9aacd33071a00568b67e110fa3bcc4d86d3e1e4.1595245166.git.amit.kucheria@linaro.org | 5 年前 | |
dt-bindings: thermal: Drop unneeded quotes Cleanup bindings dropping unneeded quotes. Once all these are fixed, checking for this can be enabled in yamllint. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230327170233.4109156-1-robh@kernel.org | 3 年前 | |
dt-bindings: armada-thermal: Add armada-ap807-thermal compatible Add marvell,armada-ap807-thermal compatible for the AP807 die. Signed-off-by: Alex Leibovich <alexl@marvell.com> Reviewed-by: Stefan Chulski <stefanc@marvell.com> Signed-off-by: Russell King (Oracle) <rmk+kernel@armlinux.org.uk> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/E1qA7yP-00Ea4o-FS@rmk-PC.armlinux.org.uk | 3 年前 | |
dt-bindings: Fix typo in comment Fix typo in the comment Signed-off-by: Slark Xiao <slark_xiao@163.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220721011746.19663-1-slark_xiao@163.com | 3 年前 | |
dt-bindings: thermal: Convert Broadcom TMON to YAML Convert the Broadcom AVS TMON Device Tree binding to YAML to help with validation. Signed-off-by: Florian Fainelli <f.fainelli@gmail.com> Link: https://lore.kernel.org/r/20211208003727.3596577-12-f.fainelli@gmail.com Signed-off-by: Rob Herring <robh@kernel.org> | 4 年前 | |
dt-bindings: thermal: convert bcm2835-thermal bindings to YAML Convert the DT binding document for bcm2835-thermal from .txt to YAML. Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230604121223.9625-10-stefan.wahren@i2se.com | 3 年前 | |
dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema This helps validating DTS files. Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210420210104.10555-1-zajec5@gmail.com | 5 年前 | |
dt-bindings: thermal: Add binding document for SR thermal Add binding document for supported thermal implementation in Stingray. Reviewed-by: Ray Jui <ray.jui@broadcom.com> Reviewed-by: Scott Branden <scott.branden@broadcom.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Pramod Kumar <pramod.kumar@broadcom.com> Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> | 7 年前 | |
Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding Device tree binding information for DA9062 and DA9061 thermal junction temperature monitor. Binding descriptions for the DA9061 and DA9062 thermal TJUNC supervisor device driver, using a single THERMAL_TRIP_HOT trip-wire and allowing for a configurable polling period for over-temperature polling. This patch also adds two examples, one for DA9062 and one for DA9061. The DA9061 example uses a fall-back compatible string for the DA9062. Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> | 9 年前 | |
Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> | 13 年前 | |
Thermal: Dove: Add Themal sensor support for Dove. The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> | 13 年前 | |
dt-bindings: drop redundant part of title (manual) The Devicetree bindings document does not have to say in the title that it is a "Devicetree binding" or a "schema", but instead just describe the hardware. Manual updates to various binding titles, including capitalizing them. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # opp Link: https://lore.kernel.org/r/20221216163815.522628-10-krzysztof.kozlowski@linaro.org [robh: add trivial-devices.yaml and net/can/microchip,mcp251xfd.yaml] Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
dt-bindings: thermal: Convert generic-adc-thermal to DT schema Convert the 'generic-adc-thermal' binding to DT schema format. The binding said '#thermal-sensor-cells' should be 1, but all in tree users are 0 and 1 doesn't make sense for a single channel. Drop the example's related providers and consumers of the 'generic-adc-thermal' node as the convention is to not have those in the examples. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221011175235.3191509-1-robh@kernel.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> | 3 年前 | |
dt-bindings: thermal: Get rid of thermal.txt and replace references Now that we have yaml bindings for the thermal subsystem, get rid of the old bindings (thermal.txt). Replace all references to thermal.txt in the Documentation with a link to the appropriate YAML bindings using the following search and replace pattern: - If the reference is specific to the thermal-sensor-cells property, replace with a pointer to thermal-sensor.yaml - If the reference is to the cooling-cells property, replace with a pointer to thermal-cooling-devices.yaml - If the reference is generic thermal bindings, replace with a reference to thermal*.yaml. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/e9aacd33071a00568b67e110fa3bcc4d86d3e1e4.1595245166.git.amit.kucheria@linaro.org | 5 年前 | |
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible Currently the dtbs_check for imx6 generates warnings like this: ['fsl,imx6sll-tempmon', 'fsl,imx6sx-tempmon'] is too long So add them to the devicetree binding. Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230410205803.45853-4-stefan.wahren@i2se.com | 3 年前 | |
dt-bindings: drop redundant part of title (end, part three) The Devicetree bindings document does not have to say in the title that it is a "binding", but instead just describe the hardware. Drop trailing "bindings" in various forms (also with trailing full stop): find Documentation/devicetree/bindings/ -type f -name '*.yaml' \ -not -name 'trivial-devices.yaml' \ -exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \; Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media Acked-by: Sebastian Reichel <sre@kernel.org> # power Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
thermal: Add support for the thermal sensor on Kirkwood SoCs This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com> | 13 年前 | |
dt-bindings: thermal: loongson,ls2k-thermal: Fix incorrect compatible definition stable inclusion from stable-v6.6.33 commit 55c54269fbd371773894c9a0c8b1e10aae52c232 category: bugfix bugzilla: https://gitee.com/openeuler/kernel/issues/IAD6H2 Reference: https://git.kernel.org/pub/scm/linux/kernel/git/stable/linux.git/commit/?id=55c54269fbd371773894c9a0c8b1e10aae52c232 -------------------------------- [ Upstream commit c8c4353685778e75e186103411e9d01a4a3f2b90 ] The temperature output register of the Loongson-2K2000 is defined in the chip configuration domain, which is different from the Loongson-2K1000, so it can't be fallbacked. We need to use two groups of registers to describe it: the first group is the high and low temperature threshold setting register; the second group is the temperature output register. It is true that this fix will cause ABI corruption, but it is necessary otherwise the Loongson-2K2000 temperature sensor will not work properly. Fixes: 72684d99a854 ("thermal: dt-bindings: add loongson-2 thermal") Cc: Yinbo Zhu <zhuyinbo@loongson.cn> Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Huacai Chen <chenhuacai@loongson.cn> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/5198999d679f1a1c3457385acb9fadfc85da1f1e.1713837379.git.zhoubinbin@loongson.cn Signed-off-by: Sasha Levin <sashal@kernel.org> Signed-off-by: Wang Hai <wanghai38@huawei.com> | 1 年前 | |
dt-bindings: thermal: Get rid of thermal.txt and replace references Now that we have yaml bindings for the thermal subsystem, get rid of the old bindings (thermal.txt). Replace all references to thermal.txt in the Documentation with a link to the appropriate YAML bindings using the following search and replace pattern: - If the reference is specific to the thermal-sensor-cells property, replace with a pointer to thermal-sensor.yaml - If the reference is to the cooling-cells property, replace with a pointer to thermal-cooling-devices.yaml - If the reference is generic thermal bindings, replace with a reference to thermal*.yaml. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/e9aacd33071a00568b67e110fa3bcc4d86d3e1e4.1595245166.git.amit.kucheria@linaro.org | 5 年前 | |
dt-bindings: thermal: mediatek: Add LVTS thermal controllers Add LVTS thermal controllers dt-binding definition for mt8192 and mt8195. Signed-off-by: Balsam CHIHI <bchihi@baylibre.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20230209105628.50294-3-bchihi@baylibre.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
dt-bindings: thermal: mediatek: Add binding documentation for MT8365 SoC Add the binding documentation for the thermal support on MT8365 SoC. Signed-off-by: Fabien Parent <fparent@baylibre.com> Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com> Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-1-55a1ae14af74@baylibre.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> | 3 年前 | |
dt-bindings: thermal: tegra: Convert to json-schema Convert the Tegra thermal bindings from the free-form text format to json-schema. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Thierry Reding <treding@nvidia.com> | 2 年前 | |
dt-bindings: thermal: tegra186-bpmp: Convert to json-schema Convert the Tegra186 (and later) BPMP thermal device tree bindings from the free-form text format to json-schema. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Thierry Reding <treding@nvidia.com> | 4 年前 | |
dt-bindings: thermal: Add binding for Tegra30 thermal sensor All NVIDIA Tegra30 SoCs have on-chip sensors which monitor temperature and voltage of the SoC. Sensors also controls CPU x2 freq throttle and emits emergency shutdown signal. TSENSOR has has two separate channels for each sensor placed in a different parts of the SoC. Add binding for the sensor hardware. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Dmitry Osipenko <digetx@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210616190417.32214-2-digetx@gmail.com | 5 年前 | |
dt-bindings: thermal: qcom,spmi-temp-alarm: convert to dtschema Convert the Qualcomm QPNP PMIC Temperature Alarm to DT Schema. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220608112702.80873-1-krzysztof.kozlowski@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> | 3 年前 | |
dt-bindings: thermal: lmh: update maintainer address The old email is no longer functioning. Fixes: 17b1362d4919 ("MAINTAINERS: Update email address") Signed-off-by: David Heidelberg <david@ixit.cz> Link: https://lore.kernel.org/r/20230823223622.91789-1-david@ixit.cz Signed-off-by: Rob Herring <robh@kernel.org> | 2 年前 | |
dt-bindings: thermal: Use generic ADC node name in examples Update the examples to reflect a future requirement for the generic channel node name on ADC channel nodes, while conveying the board name of the channel in a label instead. Signed-off-by: Marijn Suijten <marijn.suijten@somainline.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230410202917.247666-4-marijn.suijten@somainline.org | 3 年前 | |
dt-bindings: thermal: Use generic ADC node name in examples Update the examples to reflect a future requirement for the generic channel node name on ADC channel nodes, while conveying the board name of the channel in a label instead. Signed-off-by: Marijn Suijten <marijn.suijten@somainline.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230410202917.247666-4-marijn.suijten@somainline.org | 3 年前 | |
dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible MSM8909 uses the TSENS v0.1 block similar to other SoCs like MDM9607. Document the "qcom,msm8909-tsens" compatible in the existing schema. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-5-5eb632235ba7@kernkonzept.com | 3 年前 | |
dt-bindings: thermal: Drop unneeded quotes Cleanup bindings dropping unneeded quotes. Once all these are fixed, checking for this can be enabled in yamllint. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230327170233.4109156-1-robh@kernel.org | 3 年前 | |
dt-bindings: thermal: rcar-gen3-thermal: Add r8a779g0 support Document support for the Thermal Sensor/Chip Internal Voltage Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC. Unlike most other R-Car Gen3 and Gen4 SoCs, it has 4 instead of 3 sensors, so increase the maximum number of reg tuples. Just like other R-Car Gen4 SoCs, interrupts are not routed to the INTC-AP but to the ECM. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Link: https://lore.kernel.org/r/11f740522ec479011cc8eef6bb450603be394def.1675958665.git.geert+renesas@glider.be Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
dt-bindings: Fix incorrect "the the" corrections Lots of double occurrences of "the" were replaced by single occurrences, but some of them should become "to the" instead. Fixes: 12e5bde18d7f6ca4 ("dt-bindings: Fix typo in comment") Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/c5743c0a1a24b3a8893797b52fed88b99e56b04b.1660755148.git.geert+renesas@glider.be Signed-off-by: Jakub Kicinski <kuba@kernel.org> | 3 年前 | |
dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible Add a new compatible for the thermal sensor device on RK3588 SoCs. Reviewed-by: Heiko Stuebner <heiko@sntech.de> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230308112253.15659-8-sebastian.reichel@collabora.com | 3 年前 | |
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC The TSU block on the RZ/Five SoC is identical to one found on the RZ/G2UL SoC. "renesas,r9a07g043-tsu" compatible string will be used on the RZ/Five SoC so to make this clear, update the comment to include RZ/Five SoC. No driver changes are required as generic compatible string "renesas,rzg2l-tsu" will be used as a fallback on RZ/Five SoC. Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Acked-by: Rob Herring <robh@kernel.org> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20221115121629.1181667-1-prabhakar.mahadev-lad.rj@bp.renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> | 3 年前 | |
dt-bindings: update Krzysztof Kozlowski's email Krzysztof Kozlowski's @canonical.com email stopped working, so switch to generic @kernel.org account for all Devicetree bindings. Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Acked-by: Rob Herring <robh@kernel.org> Acked-by: Arnd Bergmann <arnd@arndb.de> Link: https://lore.kernel.org/r/20220330074016.12896-2-krzysztof.kozlowski@linaro.org | 4 年前 | |
dt-bindings: thermal: Fix node descriptions in uniphier-thermal example Prior to adding dt-bindings for SoC-dependent controllers, rename the thermal node and its parent node to the generic names in the example. And drop a parent node of the thermal-sensor as it is not directly necessary. Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221213082449.2721-7-hayashi.kunihiko@socionext.com Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
drivers/thermal/spear_thermal.c: add Device Tree probing capability SPEAr platforms now support DT and so must convert all drivers to support DT. This patch adds DT probing support for SPEAr thermal sensor driver and updates its documentation too. Also, as SPEAr is the only user of this driver and is only available with DT, make this an only DT driver. So, platform_data is completely removed and passed via DT now. Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com> | 13 年前 | |
dt-bindings: drop redundant part of title (end, part three) The Devicetree bindings document does not have to say in the title that it is a "binding", but instead just describe the hardware. Drop trailing "bindings" in various forms (also with trailing full stop): find Documentation/devicetree/bindings/ -type f -name '*.yaml' \ -not -name 'trivial-devices.yaml' \ -exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \; Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media Acked-by: Sebastian Reichel <sre@kernel.org> # power Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
dt-bindings: drop redundant part of title (end, part three) The Devicetree bindings document does not have to say in the title that it is a "binding", but instead just describe the hardware. Drop trailing "bindings" in various forms (also with trailing full stop): find Documentation/devicetree/bindings/ -type f -name '*.yaml' \ -not -name 'trivial-devices.yaml' \ -exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \; Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media Acked-by: Sebastian Reichel <sre@kernel.org> # power Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
thermal: sti: Remove obsolete platforms from the DT doc. STiH415/6 SoC's are being removed from the kernel. This patch removes the compatibles from the dt doc and also updates the example to a supported platform. Signed-off-by: Peter Griffin <peter.griffin@linaro.org> Cc: <rui.zhang@intel.com> Cc: <edubezval@gmail.com> Cc: <robh+dt@kernel.org> Acked-by: Rob Herring <robh@kernel.org> | 9 年前 | |
dt-bindings: drop redundant part of title (end, part three) The Devicetree bindings document does not have to say in the title that it is a "binding", but instead just describe the hardware. Drop trailing "bindings" in various forms (also with trailing full stop): find Documentation/devicetree/bindings/ -type f -name '*.yaml' \ -not -name 'trivial-devices.yaml' \ -exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \; Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media Acked-by: Sebastian Reichel <sre@kernel.org> # power Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
dt-bindings: drop redundant part of title (end, part three) The Devicetree bindings document does not have to say in the title that it is a "binding", but instead just describe the hardware. Drop trailing "bindings" in various forms (also with trailing full stop): find Documentation/devicetree/bindings/ -type f -name '*.yaml' \ -not -name 'trivial-devices.yaml' \ -exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \; Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media Acked-by: Sebastian Reichel <sre@kernel.org> # power Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
dt-bindings: drop redundant part of title (end, part three) The Devicetree bindings document does not have to say in the title that it is a "binding", but instead just describe the hardware. Drop trailing "bindings" in various forms (also with trailing full stop): find Documentation/devicetree/bindings/ -type f -name '*.yaml' \ -not -name 'trivial-devices.yaml' \ -exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \; Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media Acked-by: Sebastian Reichel <sre@kernel.org> # power Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
dt-bindings: thermal: correct thermal zone node name limit stable inclusion from stable-v6.6.44 commit a0495607c1f6fc07a9b5a7650f3a3a1bab60a46b bugzilla: https://gitee.com/openeuler/kernel/issues/IAHMJO Reference: https://git.kernel.org/pub/scm/linux/kernel/git/stable/linux.git/commit/?id=a0495607c1f6fc07a9b5a7650f3a3a1bab60a46b -------------------------------- commit 97e32381d0fc6c2602a767b0c46e15eb2b75971d upstream. Linux kernel uses thermal zone node name during registering thermal zones and has a hard-coded limit of 20 characters, including terminating NUL byte. The bindings expect node names to finish with '-thermal' which is eight bytes long, thus we have only 11 characters for the reset of the node name (thus 10 for the pattern after leading fixed character). Reported-by: Rob Herring <robh@kernel.org> Closes: https://lore.kernel.org/all/CAL_JsqKogbT_4DPd1n94xqeHaU_J8ve5K09WOyVsRX3jxxUW3w@mail.gmail.com/ Fixes: 1202a442a31f ("dt-bindings: thermal: Add yaml bindings for thermal zones") Cc: stable@vger.kernel.org Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240702145248.47184-1-krzysztof.kozlowski@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Signed-off-by: ZhangPeng <zhangpeng362@huawei.com> | 1 年前 | |
dt-bindings: drop redundant part of title (end, part three) The Devicetree bindings document does not have to say in the title that it is a "binding", but instead just describe the hardware. Drop trailing "bindings" in various forms (also with trailing full stop): find Documentation/devicetree/bindings/ -type f -name '*.yaml' \ -not -name 'trivial-devices.yaml' \ -exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \; Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media Acked-by: Sebastian Reichel <sre@kernel.org> # power Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
dt-bindings: drop redundant part of title (end, part three) The Devicetree bindings document does not have to say in the title that it is a "binding", but instead just describe the hardware. Drop trailing "bindings" in various forms (also with trailing full stop): find Documentation/devicetree/bindings/ -type f -name '*.yaml' \ -not -name 'trivial-devices.yaml' \ -exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \; Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com> Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC Acked-by: Stephen Boyd <sboyd@kernel.org> # clk Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input Acked-by: Mark Brown <broonie@kernel.org> Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media Acked-by: Sebastian Reichel <sre@kernel.org> # power Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring <robh@kernel.org> | 3 年前 | |
thermal: ti-soc-thermal: add OMAP36xx support Add OMAP36xx support to ti-soc-thermal driver. This chip is also unreliable. The data provided here is based on OMAP36xx TRM: http://www.ti.com/lit/ug/swpu177aa/swpu177aa.pdf Signed-off-by: Eduardo Valentin <edubezva@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> | 10 年前 |
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