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thermal/drivers/broadcom: Fix race between removal and clock disable stable inclusion from stable-6.6.45 commit 34e788045d0c292a8e2e79a945c0ed228441fd22 category: bugfix issue: #IB7W7N CVE: NA Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> --------------------------------------- [ Upstream commit e90c369cc2ffcf7145a46448de101f715a1f5584 ] During the probe, driver enables clocks necessary to access registers (in get_temp()) and then registers thermal zone with managed-resources (devm) interface. Removal of device is not done in reversed order, because: 1. Clock will be disabled in driver remove() callback - thermal zone is still registered and accessible to users, 2. devm interface will unregister thermal zone. This leaves short window between (1) and (2) for accessing the get_temp() callback with disabled clock. Fix this by enabling clock also via devm-interface, so entire cleanup path will be in proper, reversed order. Fixes: 8454c8c09c77 ("thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister") Cc: stable@vger.kernel.org Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-1-241644e2b6e0@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Sasha Levin <sashal@kernel.org> Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> | 1 年前 | |
thermal: intel: x86_pkg_temp_thermal: Fix bogus trip temperature stable inclusion from stable-6.6.93 commit 7093887a11fe46a0934009564e683fa96d2d89c9 category: bugfix issue: #ICCW0G CVE: NA Signed-off-by: Li Nan <linan122@huawei.com> --------------------------------------- commit cf948c8e274e8b406e846cdf6cc48fe47f98cf57 upstream. The tj_max value obtained from the Intel TCC library are in Celsius, whereas the thermal subsystem operates in milli-Celsius. This discrepancy leads to incorrect trip temperature calculations. Fix bogus trip temperature by converting tj_max to milli-Celsius Unit. Fixes: 8ef0ca4a177d ("Merge back other thermal control material for 6.3.") Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reported-by: zhang ning <zhangn1985@outlook.com> Closes: https://lore.kernel.org/all/TY2PR01MB3786EF0FE24353026293F5ACCD97A@TY2PR01MB3786.jpnprd01.prod.outlook.com/ Tested-by: zhang ning <zhangn1985@outlook.com> Cc: 6.3+ <stable@vger.kernel.org> # 6.3+ Link: https://patch.msgid.link/20250519070901.1031233-1-rui.zhang@intel.com Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Signed-off-by: Li Nan <linan122@huawei.com> | 1 年前 | |
thermal/drivers/mediatek/lvts_thermal: Check NULL ptr on lvts_data stable inclusion from stable-6.6.39 commit 79ef1a5593fdb8aa4dbccf6085c48f1739338bc9 category: bugfix issue: #IB7W7N CVE: NA Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> --------------------------------------- [ Upstream commit a1191a77351e25ddf091bb1a231cae12ee598b5d ] Verify that lvts_data is not NULL before using it. Signed-off-by: Julien Panis <jpanis@baylibre.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20240502-mtk-thermal-lvts-data-v1-1-65f1b0bfad37@baylibre.com Signed-off-by: Sasha Levin <sashal@kernel.org> Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> | 1 年前 | |
thermal/drivers/qcom/tsens-v1: Add support for MSM8937 tsens stable inclusion from stable-6.6.66 commit 9e4828b78e284adb447f763a80df8e2b34e2cee0 category: bugfix issue: #IBE7K0 CVE: NA Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> --------------------------------------- [ Upstream commit e2ffb6c3a40ee714160e35e61f0a984028b5d550 ] Add support for tsens v1.4 block what can be found in MSM8937 and MSM8917. Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org> Link: https://lore.kernel.org/r/20241113-msm8917-v6-5-c348fb599fef@mainlining.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Sasha Levin <sashal@kernel.org> Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> | 1 年前 | |
thermal/drivers/samsung: Fix Wvoid-pointer-to-enum-cast warning 'soc' is an enum, thus cast of pointer on 64-bit compile test with W=1 causes: exynos_tmu.c:890:14: error: cast to smaller integer type 'enum soc_type' from 'const void *' [-Werror,-Wvoid-pointer-to-enum-cast] Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230810091318.70261-1-krzysztof.kozlowski@linaro.org | 2 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal/drivers/tegra-bpmp: Check if BPMP supports trip points Check if BPMP supports thermal trip points, and if not, do not expose the .set_trips callback to the thermal core framework. This can happen in virtualized environments where asynchronous communication with VM BPMP drivers is not available. Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com> Acked-by: Thierry Reding <treding@nvidia.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20221129153914.2699041-1-cyndis@kapsi.fi | 2 年前 | |
thermal: Constify the trip argument of the .get_trend() zone callback Add 'const' to the definition of the 'trip' argument of the .get_trend() thermal zone callback to indicate that the trip point passed to it should not be modified by it and adjust the callback functions implementing it, thermal_get_trend() in the ACPI thermal driver and __ti_thermal_get_trend(), accordingly. No intentional functional impact. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Michal Wilczynski <michal.wilczynski@intel.com> | 2 年前 | |
thermal/drivers/loongson-2: Add thermal management support This patch adds the support for Loongson-2 thermal sensor controller, which can support maximum four sensor selectors that corresponding to four sets of thermal control registers and one set of sampling register. The sensor selector can selector a speific thermal sensor as temperature input. The sampling register is used to obtain the temperature in real time, the control register GATE field is used to set the threshold of high or low temperature, when the input temperature is higher than the high temperature threshold or lower than the low temperature threshold, an interrupt will occur. Signed-off-by: zhanghongchen <zhanghongchen@loongson.cn> Signed-off-by: Yinbo Zhu <zhuyinbo@loongson.cn> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230817021007.10350-1-zhuyinbo@loongson.cn | 2 年前 | |
thermal/drivers/loongson-2: Add thermal management support This patch adds the support for Loongson-2 thermal sensor controller, which can support maximum four sensor selectors that corresponding to four sets of thermal control registers and one set of sampling register. The sensor selector can selector a speific thermal sensor as temperature input. The sampling register is used to obtain the temperature in real time, the control register GATE field is used to set the threshold of high or low temperature, when the input temperature is higher than the high temperature threshold or lower than the low temperature threshold, an interrupt will occur. Signed-off-by: zhanghongchen <zhanghongchen@loongson.cn> Signed-off-by: Yinbo Zhu <zhuyinbo@loongson.cn> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230817021007.10350-1-zhuyinbo@loongson.cn | 2 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal: Use thermal_tripless_zone_device_register() All of the remaining callers of thermal_zone_device_register() can use thermal_tripless_zone_device_register(), so make them do so in order to allow the former to be dropped. No intentional functional impact. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Miquel Raynal <miquel.raynal@bootlin.com> | 2 年前 | |
thermal/cpufreq_cooling: Remove structure member documentation stable inclusion from stable-6.6.84 commit f225a79bd23b37b1fc695446376c9879a47e600b category: bugfix issue: #IC1IVT CVE: NA Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> --------------------------------------- [ Upstream commit a6768c4f92e152265590371975d44c071a5279c7 ] The structure member documentation refers to a member which does not exist any more. Remove it. Link: https://lore.kernel.org/all/202501220046.h3PMBCti-lkp@intel.com/ Reported-by: kernel test robot <lkp@intel.com> Closes: https://lore.kernel.org/oe-kbuild-all/202501220046.h3PMBCti-lkp@intel.com/ Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://patch.msgid.link/20250211084712.2746705-1-daniel.lezcano@linaro.org [ rjw: Minor changelog edits ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Signed-off-by: Sasha Levin <sashal@kernel.org> Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> | 1 年前 | |
Merge tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull more thermal control updates from Rafael Wysocki: "These are mostly cleanups on top of the previously merged thermal control changes plus some driver fixes and the removal of the Intel Menlow thermal driver. Specifics: - Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs check warning (Stefan Wahren) - Update the example in the DT bindings to reflect changes with the ADC node name for QCom TM and TM5 (Marijn Suijten) - Fix comments for the cpuidle_cooling_register() function to match the function prototype (Chenggang Wang) - Fix inconsistent temperature read and some Mediatek variant board reboot by reverting a change and handling the temperature differently (AngeloGioacchino Del Regno) - Fix a memory leak in the initialization error path for the Mediatek driver (Kang Chen) - Use of_address_to_resource() in the Mediatek driver (Rob Herring) - Fix unit address in the QCom tsens driver DT bindings (Krzysztof Kozlowski) - Clean up the step-wise thermal governor (Zhang Rui) - Introduce thermal_zone_device() for accessing the device field of struct thermal_zone_device and two drivers use it (Daniel Lezcano) - Clean up the ACPI thermal driver a bit (Daniel Lezcano) - Delete the thermal driver for Intel Menlow platforms that is not expected to have any users (Rafael Wysocki)" * tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: thermal: intel: menlow: Get rid of this driver ACPI: thermal: Move to dedicated function sysfs extra attr creation ACPI: thermal: Use thermal_zone_device() thermal: intel: pch_thermal: Use thermal driver device to write a trace thermal: core: Encapsulate tz->device field thermal: gov_step_wise: Adjust code logic to match comment thermal: gov_step_wise: Delete obsolete comment dt-bindings: thermal: qcom-tsens: Correct unit address thermal/drivers/mediatek: Use of_address_to_resource() thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe thermal/drivers/mediatek: Add temperature constraints to validate read Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization" thermal/drivers/cpuidle_cooling: Delete unmatched comments dt-bindings: thermal: Use generic ADC node name in examples dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible | 3 年前 | |
thermal/drivers/da9062: Don't access the thermal zone device fields The driver is reading the passive polling rate in the thermal zone structure. We want to prevent the drivers to rummage around in the thermal zone structure. On the other side, the delay is what the driver passed to the thermal_zone_device_register() function, so it has already the information. Reuse the information we have instead of reading the information we set. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal/drivers/db8500: Remove redundant of_match_ptr() The driver depends on CONFIG_OF, it is not necessary to use of_match_ptr() here. Signed-off-by: Ruan Jinjie <ruanjinjie@huawei.com> Reviewed-by: Linus Walleij <linus.walleij@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230809101439.2663042-1-ruanjinjie@huawei.com | 2 年前 | |
thermal: devfreq_cooling: Fix perf state when calculate dfc res_util stable inclusion from stable-6.6.24 commit be4f3af178cb9804ba8d174bce3c9732842dcdf8 category: bugfix issue: #IAWD7P CVE: NA Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> --------------------------------------- commit a26de34b3c77ae3a969654d94be49e433c947e3b upstream. The issue occurs when the devfreq cooling device uses the EM power model and the get_real_power() callback is provided by the driver. The EM power table is sorted ascending，can't index the table by cooling device state，so convert cooling state to performance state by dfc->max_state - dfc->capped_state. Fixes: 615510fe13bd ("thermal: devfreq_cooling: remove old power model and use EM") Cc: 5.11+ <stable@vger.kernel.org> # 5.11+ Signed-off-by: Ye Zhang <ye.zhang@rock-chips.com> Reviewed-by: Dhruva Gole <d-gole@ti.com> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> | 1 年前 | |
thermal: Use thermal_tripless_zone_device_register() All of the remaining callers of thermal_zone_device_register() can use thermal_tripless_zone_device_register(), so make them do so in order to allow the former to be dropped. No intentional functional impact. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Miquel Raynal <miquel.raynal@bootlin.com> | 2 年前 | |
thermal: core: Store trip pointer in struct thermal_instance [ Upstream commit 2c7b4bfadef08cc0995c24a7b9eb120fe897165f ] Replace the integer trip number stored in struct thermal_instance with a pointer to the relevant trip and adjust the code using the structure in question accordingly. The main reason for making this change is to allow the trip point to cooling device binding code more straightforward, as illustrated by subsequent modifications of the ACPI thermal driver, but it also helps to clarify the overall design and allows the governor code overhead to be reduced (through subsequent modifications). The only case in which it adds complexity is trip_point_show() that needs to walk the trips[] table to find the index of the given trip point, but this is not a critical path and the interface that trip_point_show() belongs to is problematic anyway (for instance, it doesn't cover the case when the same cooling devices is associated with multiple trip points). This is a preliminary change and the affected code will be refined by a series of subsequent modifications of thermal governors, the core and the ACPI thermal driver. The general functionality is not expected to be affected by this change. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Stable-dep-of: e95fa7404716 ("thermal: gov_power_allocator: avoid inability to reset a cdev") Signed-off-by: Sasha Levin <sashal@kernel.org> | 2 年前 | |
thermal: core: Store trip pointer in struct thermal_instance [ Upstream commit 2c7b4bfadef08cc0995c24a7b9eb120fe897165f ] Replace the integer trip number stored in struct thermal_instance with a pointer to the relevant trip and adjust the code using the structure in question accordingly. The main reason for making this change is to allow the trip point to cooling device binding code more straightforward, as illustrated by subsequent modifications of the ACPI thermal driver, but it also helps to clarify the overall design and allows the governor code overhead to be reduced (through subsequent modifications). The only case in which it adds complexity is trip_point_show() that needs to walk the trips[] table to find the index of the given trip point, but this is not a critical path and the interface that trip_point_show() belongs to is problematic anyway (for instance, it doesn't cover the case when the same cooling devices is associated with multiple trip points). This is a preliminary change and the affected code will be refined by a series of subsequent modifications of thermal governors, the core and the ACPI thermal driver. The general functionality is not expected to be affected by this change. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Stable-dep-of: e95fa7404716 ("thermal: gov_power_allocator: avoid inability to reset a cdev") Signed-off-by: Sasha Levin <sashal@kernel.org> | 2 年前 | |
thermal: gov_power_allocator: avoid inability to reset a cdev [ Upstream commit e95fa7404716f6e25021e66067271a4ad8eb1486 ] Commit 0952177f2a1f ("thermal/core/power_allocator: Update once cooling devices when temp is low") adds an update flag to avoid triggering a thermal event when there is no need, and the thermal cdev is updated once when the temperature is low. But when the trips are writable, and switch_on_temp is set to be a higher value, the cooling device state may not be reset to 0, because last_temperature is smaller than switch_on_temp. For example: First: switch_on_temp=70 control_temp=85; Then userspace change the trip_temp: switch_on_temp=45 control_temp=55 cur_temp=54 Then userspace reset the trip_temp: switch_on_temp=70 control_temp=85 cur_temp=57 last_temp=54 At this time, the cooling device state should be reset to 0. However, because cur_temp(57) < switch_on_temp(70) last_temp(54) < switch_on_temp(70) ----> update = false, update is false, the cooling device state can not be reset. Using the observation that tz->passive can also be regarded as the temperature status, set the update flag to the tz->passive value. When the temperature drops below switch_on for the first time, the states of cooling devices can be reset once, and tz->passive is updated to 0. In the next round, because tz->passive is 0, cdev->state will not be updated. By using the tz->passive value as the "update" flag, the issue above can be solved, and the cooling devices can be updated only once when the temperature is low. Fixes: 0952177f2a1f ("thermal/core/power_allocator: Update once cooling devices when temp is low") Cc: 5.13+ <stable@vger.kernel.org> # 5.13+ Suggested-by: Wei Wang <wvw@google.com> Signed-off-by: Di Shen <di.shen@unisoc.com> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> [ rjw: Subject and changelog edits ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Signed-off-by: Sasha Levin <sashal@kernel.org> | 2 年前 | |
thermal: core: Store trip pointer in struct thermal_instance [ Upstream commit 2c7b4bfadef08cc0995c24a7b9eb120fe897165f ] Replace the integer trip number stored in struct thermal_instance with a pointer to the relevant trip and adjust the code using the structure in question accordingly. The main reason for making this change is to allow the trip point to cooling device binding code more straightforward, as illustrated by subsequent modifications of the ACPI thermal driver, but it also helps to clarify the overall design and allows the governor code overhead to be reduced (through subsequent modifications). The only case in which it adds complexity is trip_point_show() that needs to walk the trips[] table to find the index of the given trip point, but this is not a critical path and the interface that trip_point_show() belongs to is problematic anyway (for instance, it doesn't cover the case when the same cooling devices is associated with multiple trip points). This is a preliminary change and the affected code will be refined by a series of subsequent modifications of thermal governors, the core and the ACPI thermal driver. The general functionality is not expected to be affected by this change. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Stable-dep-of: e95fa7404716 ("thermal: gov_power_allocator: avoid inability to reset a cdev") Signed-off-by: Sasha Levin <sashal@kernel.org> | 2 年前 | |
thermal: gov_user_space: Do not lock thermal zone mutex Commit 670a5e356cb6 ("thermal/core: Move the thermal zone lock out of the governors") moved thermal zone locking away from governors, but it forgot about the user space one which deadlocks now. Fix this by removing the thermal zone locking from the user space governor. Fixes: 670a5e356cb6 ("thermal/core: Move the thermal zone lock out of the governors") Tested-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal/drivers/imx8mm: Suppress log message on probe deferral nvmem_cell_read_u32() may return -EPROBE_DEFER if NVMEM supplier has not yet been probed. Future reprobe may succeed, so printing: i.mx8mm_thermal 30260000.tmu: Failed to read OCOTP nvmem cell (-517). to the log is confusing. Fix this by using dev_err_probe. This also elevates the message from warning to error, which is more correct: The log message is only ever printed in probe error path and probe aborts afterwards, so it really warrants an error-level message. Fixes: 403291648823 ("thermal/drivers/imx: Add support for loading calibration data from OCOTP") Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de> Reviewed-by: Marek Vasut <marex@denx.de> Reviewed-by: Peng Fan <peng.fan@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230708112647.2897294-1-a.fatoum@pengutronix.de | 2 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal/drivers/k3_bandgap: Remove unneeded call to platform_set_drvdata() This function call was found to be unnecessary as there is no equivalent platform_get_drvdata() call to access the private data of the driver. Also, the private data is defined in this driver, so there is no risk of it being accessed outside of this driver file. Signed-off-by: Andrei Coardos <aboutphysycs@gmail.com> Reviewed-by: Alexandru Ardelean <alex@shruggie.ro> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230810112344.3806-1-aboutphysycs@gmail.com | 2 年前 | |
thermal/drivers/k3_j72xx_bandgap: Removed unneeded call to platform_set_drvdata() This function call was found to be unnecessary as there is no equivalent platform_get_drvdata() call to access the private data of the driver. Also, the private data is defined in this driver, so there is no risk of it being accessed outside of this driver file. Signed-off-by: Andrei Coardos <aboutphysycs@gmail.com> Reviewed-by: Alexandru Ardelean <alex@shruggie.ro> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230810112015.3578-1-aboutphysycs@gmail.com | 2 年前 | |
thermal/core: Make cooling device state change private The change of the cooling device state should be used by the governor or at least by the core code, not by the drivers themselves. Remove the API usage and move the function declaration to the internal headers. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Guenter Roeck <linux@roeck-us.net> Acked-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20210118173824.9970-1-daniel.lezcano@linaro.org | 5 年前 | |
thermal: Use thermal_tripless_zone_device_register() All of the remaining callers of thermal_zone_device_register() can use thermal_tripless_zone_device_register(), so make them do so in order to allow the former to be dropped. No intentional functional impact. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Miquel Raynal <miquel.raynal@bootlin.com> | 2 年前 | |
drivers/thermal/loongson2_thermal: Fix incorrect PTR_ERR() judgment [ Upstream commit 15ef92e9c41124ee9d88b01208364f3fe1f45f84 ] PTR_ERR() returns -ENODEV when thermal-zones are undefined, and we need -ENODEV as the right value for comparison. Otherwise, tz->type is NULL when thermal-zones is undefined, resulting in the following error: [ 12.290030] CPU 1 Unable to handle kernel paging request at virtual address fffffffffffffff1, era == 900000000355f410, ra == 90000000031579b8 [ 12.302877] Oops[#1]: [ 12.305190] CPU: 1 PID: 181 Comm: systemd-udevd Not tainted 6.6.0-rc7+ #5385 [ 12.312304] pc 900000000355f410 ra 90000000031579b8 tp 90000001069e8000 sp 90000001069eba10 [ 12.320739] a0 0000000000000000 a1 fffffffffffffff1 a2 0000000000000014 a3 0000000000000001 [ 12.329173] a4 90000001069eb990 a5 0000000000000001 a6 0000000000001001 a7 900000010003431c [ 12.337606] t0 fffffffffffffff1 t1 54567fd5da9b4fd4 t2 900000010614ec40 t3 00000000000dc901 [ 12.346041] t4 0000000000000000 t5 0000000000000004 t6 900000010614ee20 t7 900000000d00b790 [ 12.354472] t8 00000000000dc901 u0 54567fd5da9b4fd4 s9 900000000402ae10 s0 900000010614ec40 [ 12.362916] s1 90000000039fced0 s2 ffffffffffffffed s3 ffffffffffffffed s4 9000000003acc000 [ 12.362931] s5 0000000000000004 s6 fffffffffffff000 s7 0000000000000490 s8 90000001028b2ec8 [ 12.362938] ra: 90000000031579b8 thermal_add_hwmon_sysfs+0x258/0x300 [ 12.386411] ERA: 900000000355f410 strscpy+0xf0/0x160 [ 12.391626] CRMD: 000000b0 (PLV0 -IE -DA +PG DACF=CC DACM=CC -WE) [ 12.397898] PRMD: 00000004 (PPLV0 +PIE -PWE) [ 12.403678] EUEN: 00000000 (-FPE -SXE -ASXE -BTE) [ 12.409859] ECFG: 00071c1c (LIE=2-4,10-12 VS=7) [ 12.415882] ESTAT: 00010000 [PIL] (IS= ECode=1 EsubCode=0) [ 12.415907] BADV: fffffffffffffff1 [ 12.415911] PRID: 0014a000 (Loongson-64bit, Loongson-2K1000) [ 12.415917] Modules linked in: loongson2_thermal(+) vfat fat uio_pdrv_genirq uio fuse zram zsmalloc [ 12.415950] Process systemd-udevd (pid: 181, threadinfo=00000000358b9718, task=00000000ace72fe3) [ 12.415961] Stack : 0000000000000dc0 54567fd5da9b4fd4 900000000402ae10 9000000002df9358 [ 12.415982] ffffffffffffffed 0000000000000004 9000000107a10aa8 90000001002a3410 [ 12.415999] ffffffffffffffed ffffffffffffffed 9000000107a11268 9000000003157ab0 [ 12.416016] 9000000107a10aa8 ffffff80020fc0c8 90000001002a3410 ffffffffffffffed [ 12.416032] 0000000000000024 ffffff80020cc1e8 900000000402b2a0 9000000003acc000 [ 12.416048] 90000001002a3410 0000000000000000 ffffff80020f4030 90000001002a3410 [ 12.416065] 0000000000000000 9000000002df6808 90000001002a3410 0000000000000000 [ 12.416081] ffffff80020f4030 0000000000000000 90000001002a3410 9000000002df2ba8 [ 12.416097] 00000000000000b4 90000001002a34f4 90000001002a3410 0000000000000002 [ 12.416114] ffffff80020f4030 fffffffffffffff0 90000001002a3410 9000000002df2f30 [ 12.416131] ... [ 12.416138] Call Trace: [ 12.416142] [<900000000355f410>] strscpy+0xf0/0x160 [ 12.416167] [<90000000031579b8>] thermal_add_hwmon_sysfs+0x258/0x300 [ 12.416183] [<9000000003157ab0>] devm_thermal_add_hwmon_sysfs+0x50/0xe0 [ 12.416200] [<ffffff80020cc1e8>] loongson2_thermal_probe+0x128/0x200 [loongson2_thermal] [ 12.416232] [<9000000002df6808>] platform_probe+0x68/0x140 [ 12.416249] [<9000000002df2ba8>] really_probe+0xc8/0x3c0 [ 12.416269] [<9000000002df2f30>] __driver_probe_device+0x90/0x180 [ 12.416286] [<9000000002df3058>] driver_probe_device+0x38/0x160 [ 12.416302] [<9000000002df33a8>] __driver_attach+0xa8/0x200 [ 12.416314] [<9000000002deffec>] bus_for_each_dev+0x8c/0x120 [ 12.416330] [<9000000002df198c>] bus_add_driver+0x10c/0x2a0 [ 12.416346] [<9000000002df46b4>] driver_register+0x74/0x160 [ 12.416358] [<90000000022201a4>] do_one_initcall+0x84/0x220 [ 12.416372] [<90000000022f3ab8>] do_init_module+0x58/0x2c0 [ 12.416386] [<90000000022f6538>] init_module_from_file+0x98/0x100 [ 12.416399] [<90000000022f67f0>] sys_finit_module+0x230/0x3c0 [ 12.416412] [<900000000358f7c8>] do_syscall+0x88/0xc0 [ 12.416431] [<900000000222137c>] handle_syscall+0xbc/0x158 Fixes: e7e3a7c35791 ("thermal/drivers/loongson-2: Add thermal management support") Cc: Yinbo Zhu <zhuyinbo@loongson.cn> Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/343c14de98216636a47b43e8bfd47b70d0a8e068.1700817227.git.zhoubinbin@loongson.cn Signed-off-by: Sasha Levin <sashal@kernel.org> | 2 年前 | |
thermal/drivers/max77620_thermal: Removed unneeded call to platform_set_drvdata() This function call was found to be unnecessary as there is no equivalent platform_get_drvdata() call to access the private data of the driver. Also, the private data is defined in this driver, so there is no risk of it being accessed outside of this driver file. Signed-off-by: Andrei Coardos <aboutphysycs@gmail.com> Reviewed-by: Alexandru Ardelean <alex@shruggie.ro> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230811191548.3340-1-aboutphysycs@gmail.com | 2 年前 | |
thermal/drivers/qoriq: Power down TMU on system suspend stable inclusion from stable-6.6.93 commit 3854f4e98ef22f6fc6d693f56832a6639a034a9e category: bugfix issue: #ICCW0G CVE: NA Signed-off-by: Li Nan <linan122@huawei.com> --------------------------------------- [ Upstream commit 229f3feb4b0442835b27d519679168bea2de96c2 ] Enable power-down of TMU (Thermal Management Unit) for TMU version 2 during system suspend to save power. Save approximately 4.3mW on VDD_ANA_1P8 on i.MX93 platforms. Signed-off-by: Alice Guo <alice.guo@nxp.com> Signed-off-by: Frank Li <Frank.Li@nxp.com> Link: https://lore.kernel.org/r/20241209164859.3758906-2-Frank.Li@nxp.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Sasha Levin <sashal@kernel.org> Signed-off-by: Li Nan <linan122@huawei.com> | 1 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal/drivers/rockchip: Add missing rk3328 mapping entry stable inclusion from stable-6.6.88 commit f75eb9acf9dfd8f4961947b8c30980985368dd58 category: bugfix issue: #IC6IH3 CVE: NA Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> --------------------------------------- commit ee022e5cae052e0c67ca7c5fec0f2e7bc897c70e upstream. The mapping table for the rk3328 is missing the entry for -25C which is found in the TRM section 9.5.2 "Temperature-to-code mapping". NOTE: the kernel uses the tsadc_q_sel=1'b1 mode which is defined as: 4096-<code in table>. Whereas the table in the TRM gives the code "3774" for -25C, the kernel uses 4096-3774=322. [Dragan Simic] : "After going through the RK3308 and RK3328 TRMs, as well as through the downstream kernel code, it seems we may have some troubles at our hands. Let me explain, please. To sum it up, part 1 of the RK3308 TRM v1.1 says on page 538 that the equation for the output when tsadc_q_sel equals 1 is (4096 - tsadc_q), while part 1 of the RK3328 TRM v1.2 says that the output equation is (1024 - tsadc_q) in that case. The downstream kernel code, however, treats the RK3308 and RK3328 tables and their values as being the same. It even mentions 1024 as the "offset" value in a comment block for the rk_tsadcv3_control() function, just like the upstream code does, which is obviously wrong "offset" value when correlated with the table on page 544 of part 1 of the RK3308 TRM v1.1. With all this in mind, it's obvious that more work is needed to make it clear where's the actual mistake (it could be that the TRM is wrong), which I'll volunteer for as part of the SoC binning project. In the meantime, this patch looks fine as-is to me, by offering what's a clear improvement to the current state of the upstream code" Link: https://opensource.rock-chips.com/images/9/97/Rockchip_RK3328TRM_V1.1-Part1-20170321.pdf Cc: stable@vger.kernel.org Fixes: eda519d5f73e ("thermal: rockchip: Support the RK3328 SOC in thermal driver") Signed-off-by: Trevor Woerner <twoerner@gmail.com> Reviewed-by: Dragan Simic <dsimic@manjaro.org> Link: https://lore.kernel.org/r/20250207175048.35959-1-twoerner@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> | 1 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal: Use thermal_tripless_zone_device_register() All of the remaining callers of thermal_zone_device_register() can use thermal_tripless_zone_device_register(), so make them do so in order to allow the former to be dropped. No intentional functional impact. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Miquel Raynal <miquel.raynal@bootlin.com> | 2 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal/drivers/sun8i_thermal: Remove unneeded call to platform_set_drvdata() This function call was found to be unnecessary as there is no equivalent platform_get_drvdata() call to access the private data of the driver. Also, the private data is defined in this driver, so there is no risk of it being accessed outside of this driver file. Signed-off-by: Andrei Coardos <aboutphysycs@gmail.com> Reviewed-by: Jernej Skrabec <jernej.skrabec@gmail.com> Reviewed-by: Alexandru Ardelean <alex@shruggie.ro> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230811194032.4240-1-aboutphysycs@gmail.com | 2 年前 | |
thermal/drivers/generic-adc: Removed unneeded call to platform_set_drvdata() This function call was found to be unnecessary as there is no equivalent platform_get_drvdata() call to access the private data of the driver. Also, the private data is defined in this driver, so there is no risk of it being accessed outside of this driver file. Signed-off-by: Andrei Coardos <aboutphysycs@gmail.com> Reviewed-by: Alexandru Ardelean <alex@shruggie.ro> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230814180921.3336-1-aboutphysycs@gmail.com | 2 年前 | |
thermal: ACPI: Make helpers retrieve temperature only It is slightly better to make the ACPI thermal helper functions retrieve the trip point temperature only instead of doing the full trip point initialization, because they are also used for updating some already registered trip points, in which case initializing a new trip just in order to update the temperature of an existing one is somewhat wasteful. Modify the ACPI thermal helpers accordingly and update their users. No intentional functional impact. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> | 3 年前 | |
thermal: core: Fix thermal zone device registration error path commit 9e07e3b81807edd356e1f794cffa00a428eff443 upstream. If thermal_zone_device_register_with_trips() fails after registering a thermal zone device, it needs to wait for the tz->removal completion like thermal_zone_device_unregister(), in case user space has managed to take a reference to the thermal zone device's kobject, in which case thermal_release() may not be called by the error path itself and tz may be freed prematurely. Add the missing wait_for_completion() call to the thermal zone device registration error path. Fixes: 04e6ccfc93c5 ("thermal: core: Fix NULL pointer dereference in zone registration error path") Cc: All applicable <stable@vger.kernel.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Tested-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://patch.msgid.link/2849815.mvXUDI8C0e@rafael.j.wysocki Signed-off-by: Hun_Dun <18967138853@163.com> | 3 个月前 | |
thermal: core: Reference count the zone in thermal_zone_get_by_id() mainline inclusion from mainline-6.12 commit a42a5839f400e929c489bb1b58f54596c4535167 category: bugfix issue: #IBJOCD CVE: CVE-2024-50028 Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> --------------------------------------- There are places in the thermal netlink code where nothing prevents the thermal zone object from going away while being accessed after it has been returned by thermal_zone_get_by_id(). To address this, make thermal_zone_get_by_id() get a reference on the thermal zone device object to be returned with the help of get_device(), under thermal_list_lock, and adjust all of its callers to this change with the help of the cleanup.h infrastructure. Fixes: 1ce50e7d408e ("thermal: core: genetlink support for events/cmd/sampling") Cc: 6.8+ <stable@vger.kernel.org> # 6.8+ Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://patch.msgid.link/6112242.lOV4Wx5bFT@rjwysocki.net Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> Conflicts: drivers/thermal/thermal_core.h drivers/thermal/thermal_netlink.c | 1 年前 | |
thermal: core: Store trip pointer in struct thermal_instance [ Upstream commit 2c7b4bfadef08cc0995c24a7b9eb120fe897165f ] Replace the integer trip number stored in struct thermal_instance with a pointer to the relevant trip and adjust the code using the structure in question accordingly. The main reason for making this change is to allow the trip point to cooling device binding code more straightforward, as illustrated by subsequent modifications of the ACPI thermal driver, but it also helps to clarify the overall design and allows the governor code overhead to be reduced (through subsequent modifications). The only case in which it adds complexity is trip_point_show() that needs to walk the trips[] table to find the index of the given trip point, but this is not a critical path and the interface that trip_point_show() belongs to is problematic anyway (for instance, it doesn't cover the case when the same cooling devices is associated with multiple trip points). This is a preliminary change and the affected code will be refined by a series of subsequent modifications of thermal governors, the core and the ACPI thermal driver. The general functionality is not expected to be affected by this change. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Stable-dep-of: e95fa7404716 ("thermal: gov_power_allocator: avoid inability to reset a cdev") Signed-off-by: Sasha Levin <sashal@kernel.org> | 2 年前 | |
thermal/hwmon: Add error information printing for devm_thermal_add_hwmon_sysfs() Ensure that all error handling branches print error information. In this way, when this function fails, the upper-layer functions can directly return an error code without missing debugging information. Otherwise, the error message will be printed redundantly or missing. Signed-off-by: Yangtao Li <frank.li@vivo.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-1-frank.li@vivo.com | 3 年前 | |
thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs() The devres variant of thermal_add_hwmon_sysfs() only takes the thermal zone structure pointer as parameter. Actually, it uses the tz->device to add it in the devres list. It is preferable to use the device registering the thermal zone instead of the thermal zone device itself. That prevents the driver accessing the thermal zone structure internals and it is from my POV more correct regarding how devm_ is used. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers The thermal zone device structure is exposed to the different drivers and obviously they access the internals while that should be restricted to the core thermal code. In order to self-encapsulate the thermal core code, we need to prevent the drivers accessing directly the thermal zone structure and provide accessor functions to deal with. Use the devdata accessor introduced in the previous patch. No functional changes intended. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car Acked-by: Mark Brown <broonie@kernel.org> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062 Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap Acked-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal: core: Reference count the zone in thermal_zone_get_by_id() mainline inclusion from mainline-6.12 commit a42a5839f400e929c489bb1b58f54596c4535167 category: bugfix issue: #IBJOCD CVE: CVE-2024-50028 Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> --------------------------------------- There are places in the thermal netlink code where nothing prevents the thermal zone object from going away while being accessed after it has been returned by thermal_zone_get_by_id(). To address this, make thermal_zone_get_by_id() get a reference on the thermal zone device object to be returned with the help of get_device(), under thermal_list_lock, and adjust all of its callers to this change with the help of the cleanup.h infrastructure. Fixes: 1ce50e7d408e ("thermal: core: genetlink support for events/cmd/sampling") Cc: 6.8+ <stable@vger.kernel.org> # 6.8+ Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://patch.msgid.link/6112242.lOV4Wx5bFT@rjwysocki.net Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> Conflicts: drivers/thermal/thermal_core.h drivers/thermal/thermal_netlink.c | 1 年前 | |
thermal/core: Fix unregistering netlink at thermal init time The thermal subsystem initialization miss an netlink unregistering function in the error. Add it. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal: of: fix OF node leak in of_thermal_zone_find() stable inclusion from stable-6.6.72 commit d2512434f4cfaa6100b8aa439ee1da2333c7daeb category: bugfix issue: #IBIAJE CVE: NA Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> --------------------------------------- [ Upstream commit 9164e0912af206a72ddac4915f7784e470a04ace ] of_thermal_zone_find() calls of_parse_phandle_with_args(), but does not release the OF node reference obtained by it. Add a of_node_put() call when the call is successful. Fixes: 3fd6d6e2b4e8 ("thermal/of: Rework the thermal device tree initialization") Signed-off-by: Joe Hattori <joe@pf.is.s.u-tokyo.ac.jp> Link: https://patch.msgid.link/20241224031809.950461-1-joe@pf.is.s.u-tokyo.ac.jp [ rjw: Changelog edit ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Signed-off-by: Sasha Levin <sashal@kernel.org> Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> | 1 年前 | |
thermal: core: Store trip pointer in struct thermal_instance [ Upstream commit 2c7b4bfadef08cc0995c24a7b9eb120fe897165f ] Replace the integer trip number stored in struct thermal_instance with a pointer to the relevant trip and adjust the code using the structure in question accordingly. The main reason for making this change is to allow the trip point to cooling device binding code more straightforward, as illustrated by subsequent modifications of the ACPI thermal driver, but it also helps to clarify the overall design and allows the governor code overhead to be reduced (through subsequent modifications). The only case in which it adds complexity is trip_point_show() that needs to walk the trips[] table to find the index of the given trip point, but this is not a critical path and the interface that trip_point_show() belongs to is problematic anyway (for instance, it doesn't cover the case when the same cooling devices is associated with multiple trip points). This is a preliminary change and the affected code will be refined by a series of subsequent modifications of thermal governors, the core and the ACPI thermal driver. The general functionality is not expected to be affected by this change. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Stable-dep-of: e95fa7404716 ("thermal: gov_power_allocator: avoid inability to reset a cdev") Signed-off-by: Sasha Levin <sashal@kernel.org> | 2 年前 | |
thermal/core: Relocate the traces definition in thermal directory The traces are exported but only local to the thermal core code. On the other side, the traces take the thermal zone device structure as argument, thus they have to rely on the exported thermal.h header file. As we want to move the structure to the private thermal core header, first we have to relocate those traces to the same place as many drivers do. Cc: Steven Rostedt <rostedt@goodmis.org> Suggested-by: Steven Rostedt <rostedt@goodmis.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org> Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org | 3 年前 | |
thermal/core: Relocate the traces definition in thermal directory The traces are exported but only local to the thermal core code. On the other side, the traces take the thermal zone device structure as argument, thus they have to rely on the exported thermal.h header file. As we want to move the structure to the private thermal core header, first we have to relocate those traces to the same place as many drivers do. Cc: Steven Rostedt <rostedt@goodmis.org> Suggested-by: Steven Rostedt <rostedt@goodmis.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org> Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org | 3 年前 | |
thermal: trip: Drop lockdep assertion from thermal_zone_trip_id() commit 108ffd12be24ba1d74b3314df8db32a0a6d55ba5 upstream. The lockdep assertion in thermal_zone_trip_id() triggers when the trip point sysfs attribute of a thermal instance is read, because there is no thermal zone locking in that code path. This is not verly useful, though, because there is no mechanism by which the location of the trips[] table in a thermal zone or its size can change after binding cooling devices to the trips in that thermal zone and before those cooling devices are unbound from them. Thus it is not in fact necessary to hold the thermal zone lock when thermal_zone_trip_id() is called from trip_point_show() and so the lockdep asserion in the former is invalid. Accordingly, drop that lockdep assertion. Fixes: 2c7b4bfadef0 ("thermal: core: Store trip pointer in struct thermal_instance") Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> | 2 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 |
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