| 文件 | 最后提交记录 | 最后更新时间 |
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nvmem: prefix all symbols with NVMEM_ This unifies all NVMEM symbols. They follow one style now. Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com> Acked-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org> Link: https://lore.kernel.org/r/20220916122100.170016-8-srinivas.kandagatla@linaro.org Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> | 3 年前 | |
thermal/drivers/qcom: Add support for LMh driver Driver enabling various pieces of Limits Management Hardware(LMh) for cpu cluster0 and cpu cluster1 namely kick starting monitoring of temperature, current, battery current violations, enabling reliability algorithm and setting up various temperature limits. The following has been explained in the cover letter. I am including this here so that this remains in the commit message as well. LMh is a hardware infrastructure on some Qualcomm SoCs that can enforce temperature and current limits as programmed by software for certain IPs like CPU. On many newer LMh is configured by firmware/TZ and no programming is needed from the kernel side. But on certain SoCs like sdm845 the firmware does not do a complete programming of the h/w. On such soc's kernel software has to explicitly set up the temperature limits and turn on various monitoring and enforcing algorithms on the hardware. Tested-by: Steev Klimaszewski <steev@kali.org> # Lenovo Yoga C630 Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210809191605.3742979-3-thara.gopinath@linaro.org | 4 年前 | |
thermal/drivers/qcom/lmh: Remove false lockdep backtrace stable inclusion from stable-6.6.61 commit 1df8231f4e99e1c808d1d5397af869ca1f4fbbd8 category: bugfix issue: #IB7W7N CVE: NA Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> --------------------------------------- commit f16beaaee248eaa37ad40b5905924fcf70ae02e3 upstream. Annotate LMH IRQs with lockdep classes so that the lockdep doesn't report possible recursive locking issue between LMH and GIC interrupts. For the reference: CPU0 ---- lock(&irq_desc_lock_class); lock(&irq_desc_lock_class); *** DEADLOCK *** Call trace: dump_backtrace+0x98/0xf0 show_stack+0x18/0x24 dump_stack_lvl+0x90/0xd0 dump_stack+0x18/0x24 print_deadlock_bug+0x258/0x348 __lock_acquire+0x1078/0x1f44 lock_acquire+0x1fc/0x32c _raw_spin_lock_irqsave+0x60/0x88 __irq_get_desc_lock+0x58/0x98 enable_irq+0x38/0xa0 lmh_enable_interrupt+0x2c/0x38 irq_enable+0x40/0x8c __irq_startup+0x78/0xa4 irq_startup+0x78/0x168 __enable_irq+0x70/0x7c enable_irq+0x4c/0xa0 qcom_cpufreq_ready+0x20/0x2c cpufreq_online+0x2a8/0x988 cpufreq_add_dev+0x80/0x98 subsys_interface_register+0x104/0x134 cpufreq_register_driver+0x150/0x234 qcom_cpufreq_hw_driver_probe+0x2a8/0x388 platform_probe+0x68/0xc0 really_probe+0xbc/0x298 __driver_probe_device+0x78/0x12c driver_probe_device+0x3c/0x160 __device_attach_driver+0xb8/0x138 bus_for_each_drv+0x84/0xe0 __device_attach+0x9c/0x188 device_initial_probe+0x14/0x20 bus_probe_device+0xac/0xb0 deferred_probe_work_func+0x8c/0xc8 process_one_work+0x20c/0x62c worker_thread+0x1bc/0x36c kthread+0x120/0x124 ret_from_fork+0x10/0x20 Fixes: 53bca371cdf7 ("thermal/drivers/qcom: Add support for LMh driver") Cc: stable@vger.kernel.org Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20241011-lmh-lockdep-v1-1-495cbbe6fef1@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Signed-off-by: zhangshuqi <zhangshuqi3@huawei.com> | 1 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal: Explicitly include correct DT includes The DT of_device.h and of_platform.h date back to the separate of_platform_bus_type before it as merged into the regular platform bus. As part of that merge prepping Arm DT support 13 years ago, they "temporarily" include each other. They also include platform_device.h and of.h. As a result, there's a pretty much random mix of those include files used throughout the tree. In order to detangle these headers and replace the implicit includes with struct declarations, users need to explicitly include the correct includes. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal/drivers/tsens: Allow configuring min and max trips IPQ8074 and IPQ6018 dont support negative trip temperatures and support up to 204 degrees C as the max trip temperature. So, instead of always setting the -40 as min and 120 degrees C as max allow it to be configured as part of the features. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-3-robimarko@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> | 3 年前 | |
thermal/drivers/tsens: Make tsens_xxxx_nvmem static This patch fixes the following sparse warnings: drivers/thermal/qcom/tsens-v1.c:24:40: sparse: warning: symbol 'tsens_qcs404_nvmem' was not declared. Should it be static? drivers/thermal/qcom/tsens-v0_1.c:26:40: sparse: warning: symbol 'tsens_8916_nvmem' was not declared. Should it be static? drivers/thermal/qcom/tsens-v0_1.c:42:40: sparse: warning: symbol 'tsens_8974_nvmem' was not declared. Should it be static? drivers/thermal/qcom/tsens-v0_1.c:64:40: sparse: warning: symbol 'tsens_8974_backup_nvmem' was not declared. Should it be static? No functional change intended. Signed-off-by: Min-Hua Chen <minhuadotchen@gmail.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230713160415.149381-1-minhuadotchen@gmail.com | 3 年前 | |
thermal/drivers/qcom/tsens-v1: Add support for MSM8937 tsens stable inclusion from stable-6.6.66 commit 9e4828b78e284adb447f763a80df8e2b34e2cee0 category: bugfix issue: #IBE7K0 CVE: NA Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> --------------------------------------- [ Upstream commit e2ffb6c3a40ee714160e35e61f0a984028b5d550 ] Add support for tsens v1.4 block what can be found in MSM8937 and MSM8917. Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org> Link: https://lore.kernel.org/r/20241113-msm8917-v6-5-c348fb599fef@mainlining.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Sasha Levin <sashal@kernel.org> Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> | 1 年前 | |
thermal/drivers/tsens: Add IPQ8074 support Qualcomm IPQ8074 uses tsens v2.3 IP, however unlike other tsens v2 IP it only has one IRQ, that is used for up/low as well as critical. It also does not support negative trip temperatures. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-4-robimarko@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> | 3 年前 | |
thermal/drivers/qcom/tsens-v1: Add support for MSM8937 tsens stable inclusion from stable-6.6.66 commit 9e4828b78e284adb447f763a80df8e2b34e2cee0 category: bugfix issue: #IBE7K0 CVE: NA Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> --------------------------------------- [ Upstream commit e2ffb6c3a40ee714160e35e61f0a984028b5d550 ] Add support for tsens v1.4 block what can be found in MSM8937 and MSM8917. Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org> Link: https://lore.kernel.org/r/20241113-msm8917-v6-5-c348fb599fef@mainlining.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Sasha Levin <sashal@kernel.org> Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> | 1 年前 | |
thermal/drivers/qcom/tsens-v1: Add support for MSM8937 tsens stable inclusion from stable-6.6.66 commit 9e4828b78e284adb447f763a80df8e2b34e2cee0 category: bugfix issue: #IBE7K0 CVE: NA Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> --------------------------------------- [ Upstream commit e2ffb6c3a40ee714160e35e61f0a984028b5d550 ] Add support for tsens v1.4 block what can be found in MSM8937 and MSM8917. Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org> Link: https://lore.kernel.org/r/20241113-msm8917-v6-5-c348fb599fef@mainlining.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Sasha Levin <sashal@kernel.org> Signed-off-by: zyf1116 <zhouyongfei3@huawei.com> | 1 年前 |
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