| 文件 | 最后提交记录 | 最后更新时间 |
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docs: thermal: add it to the driver API The file contents mostly describes driver internals. Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org> Signed-off-by: Jonathan Corbet <corbet@lwn.net> | 6 年前 | |
docs: thermal: convert cpu-idle-cooling.rst to ReST Despite being named with .rst extension, this file doesn't match the ReST standard. It actually causes a crash at Sphinx: Sphinx parallel build error: docutils.utils.SystemMessage: /devel/v4l/docs/Documentation/driver-api/thermal/cpu-idle-cooling.rst:69: (SEVERE/4) Unexpected section title. Add needed markups for it to be properly parsed. Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org> Link: https://lore.kernel.org/r/7640755514809a7b5fe2756f3702613865877dcb.1592203650.git.mchehab+huawei@kernel.org Signed-off-by: Jonathan Corbet <corbet@lwn.net> | 6 年前 | |
thermal: exynos: Rename Samsung and Exynos to lowercase Fix up inconsistent usage of upper and lowercase letters in "Samsung" and "Exynos" names. "SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked names. Therefore they should be written with lowercase letters starting with capital letter. The lowercase "Exynos" name is promoted by its manufacturer Samsung Electronics Co., Ltd., in advertisement materials and on website. Although advertisement materials usually use uppercase "SAMSUNG", the lowercase version is used in all legal aspects (e.g. on Wikipedia and in privacy/legal statements on https://www.samsung.com/semiconductor/privacy-global/). Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org | 6 年前 | |
docs: thermal: add it to the driver API The file contents mostly describes driver internals. Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org> Signed-off-by: Jonathan Corbet <corbet@lwn.net> | 6 年前 | |
Documentation: admin-guide: Move intel_powerclamp documentation Create a folder "thermal" under Documentation/admin-guide and move intel_powerclamp documentation to this folder. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 3 年前 | |
thermal: int340x: processor_thermal: Support power floor notifications Mainline: commit b473d6a9d68f5bc27c7e35f5c98172d5f2206039 ("thermal: int340x: processor_thermal: Support power floor notifications") from: v6.7-rc1 When the hardware reduces the power to the minimum possible, the power floor is notified via an interrupt. This can happen when user space requests a power limit via powercap RAPL interface, which forces the system to enter to the lowest power. This power floor indication can be used as a hint to resort to other methods of reducing power than via RAPL power limit. Before power floor status can be read or the firmware can trigger notifications regarding it, it needs to be configured via a mailbox command. The actual power floor status is read via bit 39 of MMIO offset 0x5B18 of the processor thermal PCI device. To show the current power floor status and get notification on a sysfs attribute, add 2 new attributes to /sys/bus/pci/devices/0000\:00\:04.0/power_limits/ power_floor_enable : This attribute is present when power floor notifications are supported. This attribute allows to enable/disable power floor notifications. power_floor_status : This attribute is present when power floor notifications are supported. When enabled via power_floor_enable, this attribute shows the current power floor status. The power floor implementation provides interfaces which are called from the sysfs callbacks to enable/disable and read power floor status. It also provides two additional interfaces to check if the current processor thermal device interrupt is for power floor status and to send notifications to user space. Intel-SIG: Upstream commit b473d6a9d68f ("thermal: int340x: processor_thermal: Support power floor notifications"). Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> [ rjw: Changelog and documentation changes edits ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> [ Baoli Zhang: amend commit log ] Signed-off-by: Baoli Zhang <baoli.zhang@intel.com> Signed-off-by: WangYuli <wangyuli@uniontech.com> | 2 年前 | |
documentation: Update #nouveau IRC channel network Like many free software projects, Nouveau recently moved from Freenode to OFTC. Update the reference. v3: Add acks. Signed-off-by: Alyssa Rosenzweig <alyssa@rosenzweig.io> Reviewed-by: Karol Herbst <kherbst@redhat.com> Cc: David Airlie <airlied@linux.ie> Cc: Daniel Vetter <daniel@ffwll.ch> Cc: linux-kernel@vger.kernel.org Signed-off-by: Karol Herbst <kherbst@redhat.com> Link: https://patchwork.freedesktop.org/patch/msgid/20210725150007.2818-1-alyssa@rosenzweig.io | 4 年前 | |
PM: EM: Clarify abstract scale usage for power values in Energy Model The Energy Model (EM) can store power values in milli-Watts or in abstract scale. This might cause issues in the subsystems which use the EM for estimating the device power, such as: - mixing of different scales in a subsystem which uses multiple (cooling) devices (e.g. thermal Intelligent Power Allocation (IPA)) - assuming that energy [milli-Joules] can be derived from the EM power values which might not be possible since the power scale doesn't have to be in milli-Watts To avoid misconfiguration add the requisite documentation to the EM and related subsystems: EAS and IPA. Signed-off-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 5 年前 | |
thermal/core: Remove thermal_bind_params structure Remove struct thermal_bind_params because no one is using it for thermal binding now. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230330104526.3196-1-rui.zhang@intel.com | 3 年前 | |
docs: thermal: add it to the driver API The file contents mostly describes driver internals. Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org> Signed-off-by: Jonathan Corbet <corbet@lwn.net> | 6 年前 |
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